| 摘要 |
An apparatus and method is disclosed for providing a heat shrinkable package with a frangible access panel therein defined by perforations disposed in the heat shrinkable package. A novelty of the method and apparatus resides in the perforation of the heat shrinkable material prior to passing the package through a heat shrink oven. The package is oriented on a conveyor with the perforations adjacent to the conveyor, enabling the perforated portion of the package to be subjected to less heat than the remainder of the package, enabling formation of the heat shrink package without severing the perforations defining the access panel.
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