Electroplating method and apparatus for electroplating high aspect ratio thru-holes

摘要

Electroplating apparatus and methods for plating high aspect ratio thru-holes in printed circuit boards and the like. For copper plating thru-holes in printed circuit boards, the printed circuit board is immersed in a tank of electrolyte. Surrounding both sides of the printed circuit board are a plurality of cell-like structures which contain mechanical electrolyte agitating members, filters and electrolyte ion replenishment anode baskets. In addition, a pump is provided to encourage exhausting of the electrolyte from local regions of each side of the printed circuit board to encourage a general but definite flow of electrolyte through any thru-holes in the printed circuit board. The general flow of electrolyte as encouraged by the pump is through the ion replenishment anode basket to the mechanical agitator adjacent the printed circuit board, through any thru-holes in that region of the printed circuit board and to some extent around the printed circuit board, past the mechanical agitator on the other side of the printed circuit board and through a filter adjacent the exhaust manifold for recirculation back and forth through similar cells disposed along the length of the circuit board. The mechanical agitation avoids ion depletion in the electrolyte adjacent the printed circuit board and particularly adjacent the edges of and within the thru-holes by assuring fast and continuous interchange of the "surface" electrolyte with the bulk electrolyte, which itself is replenished at an adequate rate by the background flow established by the pump. Alternate methods and apparatus are also disclosed.