| 摘要 |
A photomask for use in making a carrier tape used for automatically bonding IC devices on a substrate and having therealong sets of finger leads and sprocket holes, the carrier tape being made by exposing a metallic foil tape that is coated with a photo resist material to radiation which has passed through the photomask, the photomask including an elongated section which defines an elongated middle portion and opposite elongated outer portions, as well as at least one finger lead pattern in the middle portion and a pair of associated sprocket holes in the respective outer portions for each finger lead pattern, the pairs of sprocket holes being displaced longitudinally of the elongated section with respect to their associated finger lead pattern.
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