| 摘要 |
PURPOSE:To form an electrode pad having strong adhesive force onto a transparent electrode without requiring the use of a tapering etching method by projecting laser beams and increasing adhesive force between the electrode pad and the transparent electrode. CONSTITUTION:An electrode pad 23 is formed onto a transparent electrode 12 at a position where an image pickup section for a photoconductor layer 11 is not prevented. Laser beams are projected in the direction of the arrow 24 from the upper section of the electrode pad 23, and only the electrode pad 23 is heated and melted partially, thus improving an affinity with the transparent electrode 12 as a foundation, then enhancing adhesive power. Consequently, adhesive force between the electrode pad 23 and the transparent electrode 12 is increased to approximately quintuple as compared to that before laser annealing, and adhesive strength sufficiently resisting practical use is acquired even after a bias terminal 14 is bonded. A metal 25 for bonding, such as copper, nickel, a nickel compound, etc. having excellent bonding properties is interposed between the electrode pad 23 and the transparent electrode 12, and annealed, thus increasing adhesive force between the transparent electrode 12 and the electrode pad 23. |
