| 摘要 |
PURPOSE:To obtain a small-sized and favorably heat radiating semiconductor device by a method wherein each tie bar is provided with U-shaped curving parts at least more than one place, and at the same time, the base surfaces of the U-shaped curing parts are made to expose on the surface of the resin molding part. CONSTITUTION:The greater parts of a tie bars 11 are formed wider than each lead part 8, and at the same time, constricted parts 11b are provided at the point parts thereof. Moreover, roughly U-shaped curving parts 11a are formed at the wider parts and the horizontal parts of the curving parts 11a that is, the U-shaped base parts are made to expose on the base surface of a resin molding part 7 when the resin molding part 7 is formed. Accordingly, the tie bars 11 respectively function as the heat radiating plate. As the intrusion of moisture into the interior of the resin molding part 7 from the surface must pass through the curving path, there is little possibility that the moisture reaches the bed part mounted with a chip. Moreover, as no fin is used in this device, the number of pins can be increased more than that in the semiconductor devices with fin. |
