| 摘要 |
PURPOSE:To obtain a small-sized and favorably heat radiating semiconductor device by a method wherein the bending pieces are formed by bending the bed part mounted with a chip facing its outer peripheral edge downward, and at the same time, parts or the point parts of the bending pieces are made to expose on the lower surface of the resin molding part. CONSTITUTION:Bending pieces 17 are formed by bending a bed part 15 mounted with a chip facing its outer peripheral edge downward. The points of the bending pieces 17 are made to expose on the lower surface of a resin molding part 5. Accordingly, the bending pieces 17 respectively have a function to work as the heat radiating plate. Moreover, in a lead frame 16 to be used in this resin-sealed semiconductor device 13, numerous lead parts 6 can be provided on the same sides as the bending pieces 17 as well, because there is no protruding fin on the side surfaces of the resin molding part 5. Accordingly, the total number of pins in this device can be increased considerably more than that in semiconductor devices with pin. |
