| 摘要 |
PURPOSE:To dispense with a special means, such as an inker, in a chip separating device, by a method wherein the chip separating device is provided with a means to memorize the positions of non-defective chips and defective chips on the surface of the wafer. CONSTITUTION:When whether each chip is a non-defective or a defective is inspected by a wafer prober, the positions of the non-defective chip and the defective chip on the surface of the wafer are memorized by the position memorizing means in advance. The wafer with chips, which have finished the inspection of non-defective or defective, is separated into individual chips by cutting or a separating means. After the separation, the defective chips and the non- defective chips are discriminated on the basis of information inputted in the position memorizing means. By this method, even through such a means as an inker is not used, the discrimination can be done by this position memorizing means, and moreover, the possibility to inflict damage on the chips is also eliminated. |
