发明名称 MANUFACTURE OF HYBRID INTEGRATED CIRCUIT
摘要 PURPOSE:To facilitate the accomplishment of automated manufacturing and thereby to enhance labor-saving by a method wherein individual substrates are designed to be some integral multiples as long as metal terminal electrode point regions, the point regions are fixed immovable to prescribed positions in the pattern formed on the individual substrates, and then the substrate is separated into individual substrates. CONSTITUTION:Conductor 2 and resistors 3 are repeatedly produced on a mother substrate 1 with an equal distance between them and, for example by laser, dividing grooves 4 are provided on the surface of the substrate 1. After fixing secure of the point regions 7 of metal terminal electrodes 6 to the conductors 2 on individual substrates 5, for example by soldering, the conductors 2 are respectively fixed secure to the point regions 7. Separation is accomplished at the middle of the length between the metal terminal electrodes 6 and point regions 7, for the segmentation of the substrate 1 into individual substrate 5.
申请公布号 JPS6185850(A) 申请公布日期 1986.05.01
申请号 JP19840208623 申请日期 1984.10.04
申请人 NEC CORP 发明人 ONO KENICHI
分类号 H05K3/00;H01L21/48;H01L23/50;H05K1/03 主分类号 H05K3/00
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