发明名称 METHOD FOR FORMATION OF POLYCRYSTALLINE SILICON FILM
摘要 PURPOSE:To grow the crystal grains of large diameter of a polycrystalline silicon film by a method wherein a polycrystalline or amorphous silicon film is formed in deposition on an amorphous substrate, a heat treatment is performed, and a polycrystalline silicon film is formed by deposition thereon. CONSTITUTION:A polycrystalline silicon film 2 is formed by deposition on a quartz substrate 1 by performing an LPCVD method. The size d1 of crystal grains 1a is 150-200Angstrom or thereabout under the above-mentioned condition. A thermal oxidization is performed in a dry O2 atmosphere, an SiO2 film 3 is formed on the surface of the polycrystalline silicon film 2, crystal grains 2a are gown, the grain diameter d2 becomes 300-1,500Angstrom or thereabout. The film 3 is removed by performing an etching, a polycrystalline silicon film is formed by deposition again on the film 2 by performing an LPCVD method, and the crystal grains 2a having the grain diameter d3 which is larger than the above-mentioned grains are grown on the crystal grains 2a of the polycrystalline silicon film 2. The grain diameter d3 of the crystal grains 2a are made larger in a high degree of 2,000-3,000Angstrom .
申请公布号 JPS6185815(A) 申请公布日期 1986.05.01
申请号 JP19840207864 申请日期 1984.10.03
申请人 SONY CORP 发明人 HAYASHI HISAO;NOGUCHI TAKASHI;OOSHIMA TAKEFUMI
分类号 H01L21/20 主分类号 H01L21/20
代理机构 代理人
主权项
地址