首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
THICK SUBSTRATE
摘要
申请公布号
JPS6185889(A)
申请公布日期
1986.05.01
申请号
JP19840208620
申请日期
1984.10.04
申请人
NEC CORP
发明人
EGAWA HIDENORI
分类号
H05K3/46;H05K3/12
主分类号
H05K3/46
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Coupling for ski-binding cables
Method and apparatus for producing a therapeutically useful radiation
Suction-type floor polishing machines and other surface treating apparatus
Method of preparing nitro-olefins
Improvements in or relating to gas separation
Fluid-actuated cylinder and piston unit
Disposable absorbent element for detachable bowl smokers' pipes
Semiconductor switch
Cigarette dispenser
Improvements in the digestion of aluminous ores
Improvements in stainless steel clad with aluminum
Improvements in or relating to screw conveyors
Wrinkle-free metal shells and the production thereof from flat metal foil
Improvements relating to machines for cutting grass and like vegetation
Improvements in or relating to colour printing
Centrifugal pump assembly
Improved die accelerator mechanism
Improvements in or relating to machines suitable for use in the manufacture of shoes
An arrangement for packing and sealing cardboard containers
Improvements in or relating to methods for carrying out exothermic catalytic high pressure gas synthesis
