发明名称 METHOD OF MOUNTING SEMICONDUCTOR PELLET
摘要 PURPOSE:To enable characteristic-selecting production by reducing the time for mounting pellets per wafer by a method wherein data indicating positions and characteristics in pellet arrangement is received together with data of wafer recognition sign, and pellets having the characteristic previously specified are taken out by successive selection out of pellet groups on the basis of the received data. CONSTITUTION:The positional data file and the characteristic data file are prepared for every wafer, and further files 7 and 8 produced by adding the above-mentioned files, respectively, are recorded in a floppy disc 10. The files 7 and 8 are read out through a floppy-disc reader 21 and incorporated to an arithmetic unit 22. Data arrangement tables are prepared by making each positional data and each characteristic data of the incorporated files 7 and 8 of the unit 22 correspond to each pellet of a wafer 23. For purpose of mounting by selecting only pellets with the characteristic previously specified, pellet groups having the specific characteristics are searched, and the X-Y table is transferred by successively giving drive signals 28 to it so that a mount head 25 successively corresponds to each pellet position.
申请公布号 JPS6184845(A) 申请公布日期 1986.04.30
申请号 JP19840206662 申请日期 1984.10.02
申请人 TOSHIBA CORP;TOSHIBA SEIKI KK 发明人 KAGINO MINORU;KEIMA MASATOSHI
分类号 H01L21/52;H01L21/58;H01L21/66;H01L21/822;H01L27/04 主分类号 H01L21/52
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