| 摘要 |
PURPOSE:To enable the mount of a large-dimensional wafer ring and a substrate by preventing interference even when the wafer ring, intermediate regulation part, and substrate are moved horizontally, and to enhance the general-purpose property of the titled device by reducing the device dimensions. CONSTITUTION:The wafer ring 2 and the intermediate regulation part 5 are arranged at the position of a radius G from the center of a rotary arm 9 at the interval of 90 deg., and this part 5 and the substrate 6 are arranged at the interval of 90 deg.. The wafer ring 2 has the arrangement of chips 3-a, the level of the arrangement surface of the chips 3-a is made different from the level of the regulation surface of the chips 3-b of the intermediate regulation part 5 by a dimension F, and the level of the regulation surface is madedifferent from the level of the bonding surface of the substrate 6 by a dimension F, resulting in the arrangement of the substrate 6, intermediate regulation part 5, and wafer ring 2 in level order. Even when an X-Y table 11 and an X-Y table 12 transfer over necessary ranges in the directions of arrows X and Y, the wafer ring 2, intermediate regulation part 5, and substrate 6 can be individu ally moved under overlapping without interference with one another. |
