| 摘要 |
1. Housing for a semiconductor component comprising metallic base (10) and a hood (30) of plastics material carried by said base, characterized in that it comprises a frame (40) of resilient material having a perimeter smaller than that of the hood and exceeding that of the component, the bottom face of this frame bearing on the base and the upper face being exposed to pressure from the lower face of the top wall of the hood, the zone comprised between the outer periphery of the frame and the lateral walls of the hood being filled with an insulating curable substance adhering to these walls and to the bottom of the housing. |
