发明名称 Apparatus and method for magnetron-enhanced plasma-assisted chemical vapor deposition.
摘要 <p>A plasma CVD reactor (30) and associated process use tnagnetic field (B) enhancement (54-55) to provide high quality, very high deposition rate metal, dielectric and conformal semiconductor films (5). The reactor and process are designed for automated, high-throughput, in-line small dimension VLSI integrated circuit fabrication, and are applicable to multistep in-situ processing.</p>
申请公布号 EP0179665(A2) 申请公布日期 1986.04.30
申请号 EP19850307699 申请日期 1985.10.24
申请人 APPLIED MATERIALS, INC. 发明人 FOSTER, ROBERT;WANG, DAVID NIN-KOU;SOMEKH, SASSON;MAYDAN, DAN
分类号 C23C16/50;C23C16/04;C23C16/44;C23C16/455;C23C16/509;C23C16/517;H01J37/32;H01L21/203;H01L21/205;H01L21/31;(IPC1-7):C23C16/50 主分类号 C23C16/50
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