GEFORMTES PRODUKT MIT EINER DEKORATIVEN OBERFLAECHE UND VERFAHREN ZU DESSEN HERSTELLUNG

摘要

The present invention relates to a process for preparing chip-containing decorative surfaces wherein the chips are positioned so as to provide a pattern. A first adhesive material is selectively applied to a support surface and the conditions are adjusted so that the first adhesive material is substantially non-adhesive in nature. A second adhesive material is selectively applied as a pattern on top of or adjacent to the first adhesive material and chips are applied to the surface so as to be adhered by the second adhesive material. Any non-adhered chips are removed and the conditons are adjusted so that the first adhesive material demonstrates adhesive properties. A second type or color of chip material is then applied so as to be adhered by the first adhesive material. Upon removal of the non-adhered chips, a product is obtained having a positioned chip pattern. The process may also be practiced using additional adhesives and chips so as to provide products having more than two types of positioned chips.