| 摘要 |
PCT No. PCT/DE82/00128 Sec. 371 Date Feb. 22, 1983 Sec. 102(e) Date Feb. 22, 1983 PCT Filed Jun. 16, 1982 PCT Pub. No. WO83/00074 PCT Pub. Date Jan. 6, 1983.A semiconductor rectifier which is embodied substantially in a rotationally symmetrical manner is proposed. The semiconductor rectifier includes a semiconductor chip (10) and two connector leads (11, 12), each of which is soldered to one of the two main surfaces of the semiconductor chip (10). The first lead (11) forms a bolt-like, solid metal base, which comprises a first part (11a) soldered to the semiconductor chip (10) and a second part (11b) provided with knurling. The second lead (12) is embodied as a head wire and the head portion (12a) of this head wire is soldered to the semiconductor chip (10). A synthetic resin mass (13) is furthermore provided, which covers the rim of the semiconductor chip (10), the first part (11a) of the first lead (11) and portions of the second lead (12). The second part (11b) of the first lead (11) is pressed into a cooling plate (14) serving to cool the rectifier. In the vicinity of this second part (11b), the cooling plate forms a passage (14), which extends over the entire second part (11b), the free end (14b) of the passage (14a) covering that portion of the second part (11b) which adjoins the first part (11a). For limiting the synthetic resin (13) in the radial direction, a sheath (15) embodied in the form of a cylindrical jacket is provided, which is lapped over the passage (14a) by means of seaming. The synthetic resin mass (13) and the sheath (15) extend outward in the axial direction beyond the head portion (12a) of the second connector lead (12). (FIG. 1.
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