Tape bonding of two integrated circuits into one tape frame

摘要

A method of bonding two integrated circuit chips in a face-to-face relationship to a single site of finger leads situated in a tape-type lead frame. The finger leads contained at a single site in a lead frame are divided into two groups and are bonded in two separate bonding processes. The first group has its inner free ends configured in combination with contact bumps on a first chip, effective to leave the second group of finger leads outside the peiphery of the first chip after bonding of the first chip to the tape. In the second bonding process, a second integrated circuit chip is placed beneath the tape that has a first integrated circuit chip already bonded to the top side of it and a heated thermode having a recess in its surface. The peripheral edge of the thermode is used to complete bonding of the second integrated circuit chip to the second group of finger leads at the same site of the lead frame.