发明名称 MANUFACTURE OF IC LEAD FRAME MATERIAL
摘要 PURPOSE:To improve the working efficiency making alignment easier by a method wherein guide pinholes are punched on a base metal band at specified pitch to spot-evaporate and stamp a metallic film utilizing the guide pinholes as common reference for alignment. CONSTITUTION:A base metal band 1 with guide pinholes 11 pinched is passed through a vessel 5 by sprockets 41. A masking sheet 61 with openings punched at specified pitch is provided in the vessel 5 to open and close the openings by shifting a shielding sheet on the evaporator side. Al 72 in a crucible is melted and evaporated by an electronic gun 71 to evaporate a spot film 15 corresponding to the opening of masking sheet 61 on the surface of base metal band 1 for winding around a reel 32. Successively guide pins 81 of stamping pattern 82 are engaged with the pinholes 11 of base metal band 1 for alignment to stamp a lead frame pattern 21 using the patterns 82, 83 for winding around another reel 33. In such a constitution, any precise and complicated patterns may be produced very efficiently.
申请公布号 JPS6184046(A) 申请公布日期 1986.04.28
申请号 JP19840206009 申请日期 1984.10.01
申请人 DAIDO STEEL CO LTD 发明人 WATANABE TERUO
分类号 H01L23/50;H01L21/48 主分类号 H01L23/50
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