| 摘要 |
PURPOSE:To enable Raman spectral analysis of ultrafine adhesive without varying an object to be analyzed rapidly by driving a wafer positioning mechanism on the basis of position information stored in a memory, and providing means for deciding the adhesive for the second optical path. CONSTITUTION:When a wafer positioning mechanism 5 is driven to move a wafer 4 to the position opposed to a notch 27 of an integrating bulb 26, a laser light C emitted from a light incident port 28 into the bulb 26 by reflecting on a mirror 25 can be emitted to the surface of the wafer 4. If fine defects or fine adhesive exists on the surface of the wafer 4, the light C is scattered, and the scattered light C' is detected by a photodetector 31. After a detection signal from the photodetector 31 is amplified and high frequency noise is removed byd a low pass filter 33, the signal is A/D-converted, and stored in a memory 35. Thus, after the fine adhesive is detected by a wafer surface inspecting unit 2, Raman spectral analysis can be performed without moving the wafer 4. |
