发明名称 |
GATE AND CONTACT OF MOS INTEGRATED CIRCUIT, MUTUAL CONNECTION STRUCTURE AND MAKING THEREOF |
摘要 |
A metal gate and contact/interconnect system for MOS VLSI devices employs a multiple-level refractory metal structure including a thin layer of molybdenum for adhesion to oxide and a thicker layer of tungsten over the molybdenum. The metal gate is encapsulated in oxide during a self-aligned siliciding operation. A contact to the silicide-clad source/drain region includes a thin tungsten layer, then the molybdenum/tungstem stack, and a top layer of gold. |
申请公布号 |
JPS6181670(A) |
申请公布日期 |
1986.04.25 |
申请号 |
JP19850137655 |
申请日期 |
1985.06.24 |
申请人 |
TEXAS INSTR INC |
发明人 |
JIEEMUSU EMU MATSUKUDEBITSUDO |
分类号 |
H01L21/8234;H01L21/28;H01L21/336;H01L23/532;H01L27/088;H01L29/43;H01L29/45;H01L29/78 |
主分类号 |
H01L21/8234 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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