发明名称
摘要 PURPOSE:To improve wetting of the silver solder to prevent soldering defects, by limiting the mixture ratio of flux components for silver soldering of a metal carbide group ultrahard alloy. CONSTITUTION:The flux where mixture components are 5-30wt% borax, 15- 50wt% boric acid, 50-55wt% acid potassium fluoride, 5-20wt% potassium borofluoride, and 1-15wt% potassium hydrogencarbonate is used to perform silver soldering of a metal carbide group ultrahard alloy. The borax functions for oxidation prevention, and the boric acid functions for oxidation prevention and reduction. The acid potassium fluoride enhances the reduction function and lowers the flux melting point. The potassium borofluoride cleans the surface of the base metal. The potassium hydrogencarbonate improves the coating function.
申请公布号 JPS6115799(B2) 申请公布日期 1986.04.25
申请号 JP19790162412 申请日期 1979.12.14
申请人 MITSUBISHI METAL CORP 发明人 YOSHIDA HIDEAKI;MORIKAWA MASAKI
分类号 B23K35/363;B23K35/36 主分类号 B23K35/363
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