发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF |
摘要 |
PURPOSE:To constitute a three dimensional bipolar MOSIC by a method wherein a MOSFET composed of a bipolar type transistor as the first step semiconductor element and a channel made of amorphous silicon step semiconductor element respectively formed through the intermediary of an insulating film is formed on the surface of a semiconductor substrate. CONSTITUTION:An n<+> type buried layer 2 is buried in a part of p<-> type Si substrate 1 to grow an n<-> type Si layer 3 epitaxially as well as to form isolated p type layer 4 by means of implanting B ion. Firstly impurity is diffused to form a p type base 5, an n type emitter 6 and an n<+> type collector 7 as well as to provide an excellent electrode 8. Secondly an SiO2 film 9 is formed and etched to make recessions 11. Thirdly a-Si12 buried in the recessions 11 and doped with impurity is made into source . drain with low resistance n<+> type conductivity. Fourthly another a-Si13 entirely doped with impurity is thinly formed. Fifthly p<+> type impurity is diffused in the upper thin a a-Si film 13 to form an n<+> or p<+> type layer. Finally a thick CVD.SiO2 film 14 is formed to form another thin SiO2 film 15 as a gate further forming an electrode 16. |
申请公布号 |
JPS6180849(A) |
申请公布日期 |
1986.04.24 |
申请号 |
JP19840201757 |
申请日期 |
1984.09.28 |
申请人 |
HITACHI LTD;HITACHI MICRO COMPUT ENG LTD |
发明人 |
TAKAGI TATSUHAYA;KOWASE YASUAKI;ICHIKAWA TAKAYOSHI;INABA TORU;KONDO SHIZUO |
分类号 |
H01L27/00;H01L21/20;H01L21/822;H01L21/8249;H01L27/06 |
主分类号 |
H01L27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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