| 摘要 |
PURPOSE:To adequately increase photocoupling efficiency involving a light- receiving section by a method wherein the light take out section is formed of a semiconductor material, the semiconductor element is bonded to the light take out window, one of the terminal is connected to the light take out window, and the other terminal is connected to the opposite side. CONSTITUTION:An optical semiconductor element 4 is for example a light- emitting diode chip composed of an AlGaAs-based material, with the light take out window 6b composed for example of a GaP-based semiconductor. The optical semiconductor element 4 is bonded with an adhesive agent or fixed tight to the light take out window 6b. One of terminals 1b is connected to the light take out window 6b, and the other terminal 1b is connected with a lead wire 1c to the surface opposite to the surface in contact with the light take out window 6b, of the optical semiconductor element 4. Light emitted by the optical semiconductor element 4 goes through the light take out window 6b to enter an optical fiber 7. Loss of light due to absorption by the semiconductor-made light take out window 6b is virtually negligible when good materials are selected to constitute the device. |
