| 摘要 |
<p>PURPOSE:To simplify a color filter (CF) forming method and to prevent a corrosion of a bonding pad (BP) in a solid image pick-up element by etching silica glass (SG) piled up on the BP using the color filter (CF) as a mask. CONSTITUTION:After forming AlBP part 2, the SG3 which is not etched, is piled up on the part 2. And then the CF5 is formed on the SG3, but, AlBP2 can neglect a problem of a corrosion, since AlBP is coated with the SG3. As an opening portion at the BP part is provided in a photomask used in the course of the CF forming method by removing an org. material, the reaction (the formation of the opening portion) is carried out on the surface of the SG3. A protective film 8 coated on a whole of the CF is formed from for example, an acrylic resin etc. and the SG3 provided on the BP part is etched with the mask of the CF, in the final step of the manufacture of the above described element. As the acrylic resin used to the protective film is a corrosion resistance and has a good adhesive property, the BP part 2 which is less tendency for generating a side etching and is suitable for a wire bonding is exposured, thereby protecting the BP2 from the corrosion.</p> |
