发明名称 |
Process for producing copper through-hole printed circuit board. |
摘要 |
<p>Disclosed is a process for producing a copper through-hole printed circuit board, which comprises forming a required pattern on a copper-clad laminated plate using a resist ink soluble in an alkaline aqueous solution, immersing the copper-clad laminated plate in an aqueous solution of a salt or an alkylimidazole compound represented by the following general formula
<Chemistry id="chema01" num="0001"><Image id="ia01" he="22" wi="30" file="IMGA0001.TIF" imgContent="chem" imgFormat="TIFF" inline="no" /></Chemistry>wherein R<Sub>2</Sub> represents an alkyl group having 5 to 21 carbon atoms, R<Sub>4</Sub> represents a hydrogen atom or a methyl group, and HA represents an organic or inorganic acid,
to form on the copper surface of the copper-clad laminated plate an etching resist film composed of the alkylimidazole compound, drying the resulting copper-clad laminated plate, and then treating it with an alkaline etching solution.</p> |
申请公布号 |
EP0178864(A2) |
申请公布日期 |
1986.04.23 |
申请号 |
EP19850307304 |
申请日期 |
1985.10.11 |
申请人 |
SHIKOKU CHEMICALS CORPORATION |
发明人 |
TSUKAGOSHI, MINORU;NAKAYAMA, TAKUO;MINAGAWA, MASAHIKO;YOSHIDA, SHUJI |
分类号 |
C23F1/02;H05K3/00;H05K3/06;H05K3/42;(IPC1-7):H05K3/42 |
主分类号 |
C23F1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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