| 摘要 |
PURPOSE:To prevent the generation of failures of electrical connection by composing the height of leading pins from a surface of a substrate stepwise so that it becomes higher as the position of the pin is more distant from a semiconductor chip. CONSTITUTION:The height of a head 2A of a leading pin 2 is constituted so that it becomes higher as the arranged position of the pin 2 is more distant from a semiconductor chip 3. In the assembly of this semiconductor device, pins 2 are inserted in holes of a substrate 1 and a semiconductor chip is bonded in the center of the substrate 1 and wires 4 are bonded to the pins 2 followed by covering with resin 5 thereby completing the semi-conductor device. By this constitution, the mutual shortage among the bonded wires 4 can prevented and it is possible to form an electrical connection part in one position. |
