发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To contrive the improvement in the resistance to humidity and cracks by sealing the device with the composition of the epoxy resin consisting mainly of a phenol novolak type epoxy resin comprising a t-butyl radical in which a proper quantity of a curing agent is added. CONSTITUTION:The epoxy resin expressed by the formula having R as H or a metyl radical is used and a ratio of quantity of a t-butyl radical is selected to be 10-30wt% and epoxy equivalent is 220-270 and softening temperature is 60-90 deg.C. Also it is possible to substitute a phenol novolak epoxy resin, a cresol novolak epoxy resin and etc. for that up to 50wt%, but also in that case, the ratio of t-butyl radical to the whole epoxy resin must be selected to be 10-30wt%. The resin used together with is of an epoxy equivalent of 170-220 and a softening temperature of 60-90 deg.C. Furthermore, for a curing agent, a novolak type phenol group resin of hydroxyl group equivalent of 90-120 and a softening point 50-130 deg.C is used. It mixed by the ratio of 0.9-1.1 hydroxyl equivalent to 1 epoxy equivalent of the epoxy resin and a catalyst, an inorganic filler and etc. are added. Those are sealed with the composition which is heat-kneaded uniformly.</p>
申请公布号 JPS6179246(A) 申请公布日期 1986.04.22
申请号 JP19840200800 申请日期 1984.09.26
申请人 NITTO ELECTRIC IND CO LTD 发明人 KUWATA KAZUYUKI;KIMURA HIDETO
分类号 C08G59/00;C08G59/20;H01L23/29;H01L23/31 主分类号 C08G59/00
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