发明名称 SILVER SOLDER MATERIAL
摘要 PURPOSE:To obtain a titled material which is excellent in corrosion resistance at the time of use and in a post-treatment process, and also to hold it in sufficient spreading property and wettability by forming a solder material by adding Ge, Pd and Li of a specified quantity to Ag. CONSTITUTION:A silver solder material is constituted of 0.05-19% Ge, 0.01-10% Pd, 0.01-2% Li, and Ag as a balance. Also, by adding one kind or two kinds or more of Fe, Co and Ni to an Ag-Ge-Pd-Li compound alloy, in case when a base metal of Fe, Co and Ni, and their alloy, for instance, 42 Fe-Ni, covar, stainless steel, etc. has been soldered, the metallic organization is fined and also the soldering strength is improved.
申请公布号 JPS6178592(A) 申请公布日期 1986.04.22
申请号 JP19840198614 申请日期 1984.09.25
申请人 KYOCERA CORP;TOKURIKI HONTEN CO LTD 发明人 HOSOI YOSHIHIRO;DAIGO HIROTO;KUNITOMO MINOBU;NARA TAKASHI
分类号 C22C5/06;B23K35/28;B23K35/30 主分类号 C22C5/06
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