发明名称 TAPE FOR TAPING SEMICONDUCTOR PARTS
摘要 PURPOSE:To positively distinguish semiconductor parts as well as to eliminate erroneous insertion of semiconductor parts by a method wherein the pockets for accommodating semiconductor parts are provided with a see-through hole for identifying that semiconductor parts, the pockets being formed on the body of a tape at a predetermined interval along the longitudinal direction. CONSTITUTION:Pockets 2 for accommodating semiconductor parts are provided on a tape 1 at a predetermined interval. A see-through hole 3 is formed in the bottom of the pockets 2. The opening side of the pockets 2 for taking in and out the semiconductor parts is covered with a transparent cover tape 4 after insertion of the semiconductor parts. since the semiconductor parts in the pockets 2 can automatically be sensed by a light through the see-through hole 3, the semiconductor parts in the pockets 2 can be positively distinguished.
申请公布号 JPS6179220(A) 申请公布日期 1986.04.22
申请号 JP19840201260 申请日期 1984.09.26
申请人 TOSHIBA CORP 发明人 OTSUKA KOZO
分类号 H01L21/673;H01L21/02;(IPC1-7):H01L21/02 主分类号 H01L21/673
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