发明名称 CREAM SOLDER
摘要 PURPOSE:To suppress the generation of a solder ball, and to omit a cleaning process to be executed after soldering, by kneading fine particles of a solder alloy deformed aspherically by applying a mechanical pressure, and a flux, and forming a cream solder. CONSTITUTION:Solder particles 7 are put into a liquid in a pressure tank 6, it is pressed by a pressure member 8, and a desired solder powder is obtained. The pressure is applied by magnitude of the extent that the solder particles are deformed to an aspherical state. By mixing a flux in this amorphous solder powder, a cream solder is obtained. Since the solder powder is aspherical, it comes to scarcely flow by the flux, and scarcely becomes a solder ball.
申请公布号 JPS6178589(A) 申请公布日期 1986.04.22
申请号 JP19840200538 申请日期 1984.09.27
申请人 SONY CORP 发明人 IIDA HIROYUKI;HAYASHI MISAE
分类号 B23K35/22;B23K35/02;H05K3/34 主分类号 B23K35/22
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