| 摘要 |
PURPOSE:To improve the measurement precision of film thickness by irradiating a sample surface with an ultrasonic beam having characteristic angles of incidence characteristic to materials of a substrate and a film and receiving reflected ultrasonic waves reflected by the surface. CONSTITUTION:A piezoelectric film 32 is formed at one terminal of an ultrasonic wave propagation material 31 and a conic recessed channel 39 is provided at the other terminal; when the vertical angle 34 of the recessed channel 39 is set, an ultrasonic wave 38 which enters a solid-state substrate 36 from liquid 35 for ultrasonic wave propagation is made incident on materials of a substrate 36, liquid 35, and film 37 at characteristic angles of incidence. Then, the film 37 is irradiated with the wave 38 at its characteristic angle of incidence and the wavelength (lambda) of a frequency at which reflection intensity is minimum is measured to calculate the film thickness (d) from d=lambda.H. Consequently, the film thickness on a base board and its two-dimensional distribution are measured precisely in a short time. |
