| 摘要 |
<p>PURPOSE:To prevent the moisture resistance of a molded semiconductor device for deteriorating by a method wherein a flame treatment is performed on the molding surface of the device, whereon a printing is to be performed, before the printing is performed. CONSTITUTION:Hydrogen flame, which burns at temperatures of 1,000 deg.C to 2,000 deg.C, and so forth are used as a flame 4 and the molding surface 2, whereon a printing is to be performed, of a semiconductor device 1 separated individually after a molding is performed is roasted by the high-temperature part of the point of the flame 4 for 1-2 seconds or thereabouts. According to this method, the release agent, the oil content, the dust and so forth which are adhering on the surface 2, are decomposed and volatilized as being toasted by the flame 4. As a result, the dispersion of cleanness is eliminated and a uniform and stable strength of print is obtained.</p> |
