| 摘要 |
PURPOSE:To perform excellent wire bonding process preventing a bonding wire and a ball formed on the bonding wire from being oxidized by a method wherein a capillary is provided with a shielded body jetting inert gas. CONSTITUTION:An element to be bonded 2 is preliminarily heated up to specified temperature by a heating stage 1 to form a ball 13 at an end of bonding wire 8 led out of a capillary 4. A shielded body 5 filled with inert gas 6 may prevent the surface of formed ball 13 and the bonding wire 8 itself from being oxidized. Later the bonding wire 8 with the formed ball 13 leads the capillary 4 contained in the shielded body 5 to the specified position on the element to be bonded 2 for bonding process. Through these procedures, the bonding wire 8 made of Cu wire etc. apt to be oxidized may perform bonding process subject to excellent bondability. |
