| 摘要 |
<p>PURPOSE:To prevent occurrence of accidents such as falling off, breakage and peeling even if subjected to bending deformation by covering the surface and back of the substrate of a card with outer cover layers and holding an IC unit by them. CONSTITUTION:An IC unit 4 made by molding an IC chip 1 having built-in UV-EPROM by a material that transmits ultraviolet rays is put in a hole 6 pierced in a card substrate 5, and the surface and back of the substrate 5 are covered with outer covering layers 7, 9 to hold the unit 4. When molding then unit 4, a mold layer 12 made of a resin that does not transmit ultraviolet rays is formed as an ultraviolet-ray intercepting part on the circumferential part other than a part just above the chip 1. The outer cover layer of the surface 9 is made of a material that transmits ultraviolet rays. By this constitution, the unit is held firmly and the unit 4 does not fall off even if subjected to large bending deformation. As there is no hole in the window 10, no breakage takes place, and the exfoliation of adhesion of each part does not occur.</p> |
