| 摘要 |
PURPOSE:To enable the connection of chips with one another without using bonding wires, by a method wherein conductive connection parts are provided from the side surface to the up-down surfaces in the periphery of a semiconductor device chip, so that these conductive connection parts may contact one another when chips are laminated. CONSTITUTION:Through-holes 3 are formed on scribe lines 2 of a semiconductor device wafer 1 by crossing the scribe lines 2 (so as to invade to chip regions). Thereafter, these through-holes 3 are filled with metal buried layers 4, and at the same time these layers 4 are connected to desired electrode wirings 5. A plurality of chips 6 having conductive connection parts 4 in the periphery are formed by separating each chip, and these chips 6 are laminated so that the peripheral conductive connection parts 4 may contact one another. |
