| 摘要 |
<p>PURPOSE:To improve a polishing velocity as well as to make the partial modification of a work surface form performable in an easy manner, by polishing a work while radiating a laser beam to a polishing position. CONSTITUTION:In time of operation, like the conventional liquid polishing, a work 2 and a polisher 4 perform relative motion as being pressed with proper pressure. On the other hand, a laser beam is continuously or intermittently radiated out of a light guide 10 into a polishing solution 8. With this radiation, the polishing solution 8 is partially heated so suddenly, turning it into high temperature and high pressure, thus polishing action is accelerated. And, etching on a work surface of the work 2 also takes place by the laser beam radiation but marks of this etching is removed by the polishing action so that there is no adverse influence on the work surface. In addition, the laser beam radiation is partially carried out but the polisher 4 and the work 2 both perform relative motion with each other whereby the laser beam is uniformly radiated over the whole lot of the work surface of the work 2 in consequence, thus a polishing velocity is improved and partial modification is performable.</p> |
