发明名称 Substrate coating by cathodic sputtering andevaporation
摘要 <p>Coating of a substrate under reduced pressure consists of (a) producing a thin anchoring layer on the substrate by cathodic sputtering, (b) applying the desired material layer on top of the anchoring layer by an evaporation process. The anchoring layer is produced using a plasma generator consisting of a tube shaped electrode, the axis of which passes through the electron emitting wire from which it is separated by a diaphragm, and a magnetic coil equiaxed with the electrode. Pref., the two layers may be produced in a single chamber when there is a gradual changeover in compsn. or, alternatively, the anchoring layer may be produced in a first chamber after which the substrate is transferred to a second where the evaporation coating process is carried out.</p>
申请公布号 FR2082217(A5) 申请公布日期 1971.12.10
申请号 FR19700008177 申请日期 1970.03.06
申请人 ALCATEL 发明人
分类号 C23C14/02;C23C14/22;C23C14/46;H01J37/34;(IPC1-7):23C15/00;23C13/00 主分类号 C23C14/02
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