| 摘要 |
PURPOSE:To improve cooling efficiency of a semiconductor device by surrounding a semiconductor chip with gel such as silicon rubber, etc. mixing powder of substance having a high thermal conductivity. CONSTITUTION:A semiconductor chip 1 is loaded on a package substrate 3 through an exploded electrode 2 of the flip-chip type and a dam 4 is provided at the predetermined position of the package substrate 3. This dam 4 is filled with gel 6 such as silicon rubber mixing powder 5 of substance having a high thermal conductivity in such a manner as surrounding the semiconductor chip 1 and the package 3 is sealed with a cap 7 using a bonding agent 8 such as a low melting point glass. As a powder of substance having high thermal conductivity to be mixed with gel 4, for example, a silicon carbide containing a little amount of beryllium is used. Thereby, the heat generated in the semiconductor chip 1 can be transmitted to the package substrate 3 and radiated therefrom through not only an exploded electrode 2 but also gel 6 mixing powder 5 of a substance having a high thermal conductivity. Accordingly, the cooling efficiency of semiconductor chip 1 can be improved. |
