SEMICONDUCTOR DEVICE

摘要

PURPOSE:To eliminate corrosion of aluminum wiring due to melt-away of phosphorus and prevent disconnection defect of aluminum wiring by eliminating a film containing phosphorus at the area just under the bonding pad which is external terminal of aluminum wiring and periphery thereof. CONSTITUTION:A phosphor glass film or PSG film 4 is formed on the surface of a surface oxide film 3. The phosphor glass or PSG film is eliminated from the periphery including a part of bonding pad 5 and wiring 5 and there is no phosphor glass or PSG film at least in the area near the window opening part (indicated by a broken line) of the passivation film. Thereby phosphorus does not melt-away even if water penetrates through the bonding pad portion and corrosion of aluminum wiring can be prevented because phosphoric acid is not generated. On the other hand, there is phosphor glass and PSG film at the other portion, the surface is sufficiently stabilized.