Method for coating copper-clad printed circuit boards

摘要

The invention relates to a method for coating copper-clad printed circuit boards with coatings in a horizontal pass. The coating methods used in the fabrication of printed circuit boards are geared to the application in question and not generally usable. To overcome this drawback, the invention provides a method for electrostatic coating of printed circuit boards. As a result, it is possible both to generate structures and to apply solder resists to already present structures.