| 摘要 |
<p>PURPOSE:To make it possible to enhance yield by avoiding the close adhesiveness of partial glaze and a mask, by providinga part thicker than partial glaze by a printing paste during a manufacturing process at a position having no relation to a film circuit pattern. CONSTITUTION:After a glaze part 2 is formed to a ceramic substrate 1, a heat resistant insulating resin is printed on a common conductor part and baked and a tantalum silicide layer 3 for a heat generation resistor is formed by a sputtering method. Further, an aluminum film 4 is formed as a wiring conductor layer by sputtering. A photo-resist film 6 is applied to the entire surface of a substrate to perform the closely adhesive type exposure of a mask 7 and the substrate. At first, the aluminum film is etched by a phosphoric acid etchant and the tantalum silicide film is etched subsequently by a fluorine type etchant. After the photo-resist film is released, the aluminum film is removed by the phosphoric etchant according to the similar photoresist method in order to form the heat generating resistor pattern 10 on partial glaze.</p> |
