发明名称 TRANSFER MOLD FORMING DEVICE FOR SEMICONDUCTOR RESIN SEALING
摘要 PURPOSE:To meet the stable forming requirements despite dispersion of resin amount by a method wherein multiple auxiliary exit cylinders to be independently reciprocated separating from a main exit cylinder are provided to be operated in variable combination with one another. CONSTITUTION:A cylinder plate 2 actuated by reciprocation of a main exit cylinder 1 is fixed to the cylinder 1. Multiple auxiliary exit cylinders 6 to be reciprocated separating from the cylinder 1 are assembled into an unit 5 and independently fixed to the cylinder plate 2. When metallic molded pots 10 are charged with tablets, b, c made of different amount of resin, plungers 9 are lifted by the cylinder 1l at even speed to fill the cavities 13, 14 with the resins b, c. Finally the main exit cylinder 1 stops lifting operation thereof leaving the cavities 13, 14 slightly unfilled to be completely filled with the resins b, c by means of independently lifting the cylinders 6.
申请公布号 JPS6174343(A) 申请公布日期 1986.04.16
申请号 JP19840196113 申请日期 1984.09.19
申请人 NEC CORP 发明人 SATO WATARU
分类号 H01L21/56;B29C45/02;B29C45/14;B29K101/10;B29L31/34 主分类号 H01L21/56
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