发明名称 |
Photosensitive composition. |
摘要 |
A photosensitive composition of this invention comprises: (a) a photosensitive diazo resin represented by the following general formula (I): <IMAGE> (I) wherein R1, R2 and R3 each represents a hydrogen atom, an alkyl or alkoxy group, R represents a hydrogen atom, an alkyl or phenyl group, X represents PF6 or BF4 and n represents a number of 1 to 200, in which a resin with the number n in the above formula being 5 or more is contained by more than 20 mol %, (b) an oleophilic high molecular weight compound with hydroxyl group and (c) a high molecular weight organic acid without hydroxyl group, and in which the content of the ingredient (c) is from 1.5 to 30% by weight based on the solid matter in said composition. The photosensitive composition of this invention can provide a photosensitive layer having high sensitivity and being excellent in storage stability and developability as well as excellent in the film strength. |
申请公布号 |
EP0177962(A2) |
申请公布日期 |
1986.04.16 |
申请号 |
EP19850112867 |
申请日期 |
1985.10.10 |
申请人 |
MITSUBISHI CHEMICAL INDUSTRIES LIMITED;KONISHIROKU PHOTO INDUSTRY CO. LTD. |
发明人 |
TOMIYASU, HIROSHI;MAEDA, YOSHIHIRO;GOTO, KIYOSHI;SUZUKI, NORIHITO |
分类号 |
G03F7/016;G03C1/52;G03C1/54;G03C1/60;G03F7/004;G03F7/021;G03F7/033;G03F7/038 |
主分类号 |
G03F7/016 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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