| 摘要 |
Apparatus and method for handling articles, such as semiconductor wafers, wherein an article is movable by the apparatus from one location along a continuous path to any one of a number of other locations in a sequence so that process steps for other functions can be performed at each station. The apparatus is suitable for use with a microscope having a work station at which articles can be inspected one after another. The apparatus includes a pair of concentric rings, the inner ring being rigidly secured to a microscope and surrounding the upright center post of the microscope. The outer ring is rotatable on the inner ring and has a number of circumferentially spaced article pick-up devices which operate to receive articles and carry them one by one to the work station where a vacuum chuck can become coupled to each article and an X-Y positioning unit can be used to shift the article beneath an optical system for viewing the article. Several embodiments of the pick-up devices on the outer ring are disclosed. The pick-up device can be a vacuum operated or mechanical in construction and at least one embodiment of each type of device is disclosed.
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