发明名称 INJECTION MOLDING PROCESS
摘要 PURPOSE:To simplify the fitting of a base plate, while carrying out simultaneously metallic plate working and injection molding, and contriving to shorten forming process by injecting resin, after the metallic base plate in a mold has been worked by performing the mold cramping of the mold provided with metallic plate working members. CONSTITUTION:After a base plate has been fitted into the molds provided with the metallic plate working members such as the punch 13 for folding process and the punch 18 for embossing process, said molds are clamped, and the folded part 19, the projected part 20 caused by embossing process, etc. are formed on the metallic base plate by the clamping force generating when the gap between plates 5, 6, the gap between plates 6, 7 and the gap between plates 8, 9 are closed. Next, after the metallic plate has been completely worked, injection molding is achieved into the portion of the base plate 2 by injecting resin. Thus, functional parts 22, etc. are formed.
申请公布号 JPS6172510(A) 申请公布日期 1986.04.14
申请号 JP19840195402 申请日期 1984.09.18
申请人 SONY CORP 发明人 FUKUI KOICHIRO;KISHI SHINSUKE;YAMADA HIDETAKA
分类号 B29C45/26;B29C45/14 主分类号 B29C45/26
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