| 摘要 |
PURPOSE:To reduce bonding failures generating when a semiconductor chip is bonded to a CERFIP package by a method wherein the pressure of the chip is reduced during scribing. CONSTITUTION:A mechanism which varies the pressure P, made up by engaging a linear motor 7 in the middle between a collet 2 and a supporting point 4 in a bonding arm 4, is added to the die bonding device. The linear motor 7 has a coil 9 engaged to the bonding arm arranged so as to move up and down in the magnetic field 8a formed by a magnetic circuit 8 having a permanent magnet. When the coil 9 is conducted, a force induced up and down by the direction and value of its current in proportion to this value is transmitted to the bonding arm 3. Therefore, the pressure P can be arbitrarily varied by varying the current value of the coil 9 while the collet 2 presses the chip 1 to the chip mount surface. |
