| 摘要 |
<p>PURPOSE:To prevent damage from being generated by measurement probes by a method wherein a hybrid IC sealed in a package is processed with laser beams from outside the package. CONSTITUTION:The hybrid IC6 is internally bonded to outer leads 4 with Au wires 7 and the like, and further processed with laser beams 5 so as to come into required functions while being measured with the outer leads 4 of the IC package 1 resulting from outer sealing with an impermeable insulating resin 2 which is impermeable to laser beams 5 and a permeable insulating resin 3 which is permeable to laser beams 5. This manner enables functional trimming with laser beams 5 while the IC is measured with the outer leads 4 of the final IC package 1 resulting from outer sealing; therefore, defects such as damage due to element trimming and characteristic changes due to outer sealing can be eliminated.</p> |
