发明名称 BONDING METHOD
摘要 PURPOSE:To eliminate the variability with bonding strength and at the same time to contrive to improve the strength level by a method wherein both of the first and second ponds are provided with metallic balls. CONSTITUTION:A metallic ball 21 is formed to a metallic wiring 24 and held by a capillary 22 having a recess 23, and when the capillary 22 adhered to the conductor 25 formed on an element 26 is raised, a hydrogen torch 30 acts and metallic balls 27 and 28 are formed; then, the ball 28 moves to a point 28' when the capillary split 29 is opened. The ball 27 is chucked during the action of changing the capillary split 29 from open to close and adhered to the conductor 27 formed on an element 32; next, the ball 28 is moved to the position of the ball 21 with high-pressure air 33. Thereafter, these bonding actions are repeated.
申请公布号 JPS6171642(A) 申请公布日期 1986.04.12
申请号 JP19840194106 申请日期 1984.09.17
申请人 NEC CORP 发明人 SENBA NAOHARU
分类号 H01L21/60 主分类号 H01L21/60
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