Thin film resistances/contacts prodn - by electrodeposition and etching

摘要

Resistance and contacts are formed on a substrate by electrodepositing the resistance layer on the substrate, and selectivity etching the resistance layer. Pref. the substrate is first roughened and sensitised by immersing in a HCl soln. of tin chloride. The sensitised substrate is activated, pref. with a HCl soln. of palladium chloride. The substrate is then washed and the resistance layer is electrodeposited. The resistance material is Ni, Cr, Ta, Ta nitride, Sn oxide etc. The layers are firmly bonded and cannot be easily removed.