EQUIPMENT FOR BREAKING SEMICONDUCTOR WAFER

摘要

PURPOSE:To enable applying optimum breaking pressure uniformly on a whole semiconductor wafer avoiding defective breaking by mechanically applying pressure on the wafer with a pressure roller and a breaking roller using a cylinder. CONSTITUTION:The position of a piston in a cylinder 6 is set to apply required optimum pressure on a semiconductor wafer 3 for breaking when the piston comes down and pressure rollers 7, breaking rollers 8 and the semiconductor wafer 3 are integrated. The position of the piston in the cylinder 6 can be adjusted to apply optimum pressure for breaking on the semiconductor wafer 3 since the breaking roller 8 has vertical play and the semiconductor wafer 3 is placed on a break table 2 made of urethane. After the pressure to be applied is adjusted, the ruled semiconductor wafer 3 is placed on the break table 2 and cut into minute pieces along a scribe line a driving motor 14 being rotated.